Size-dependence Elastic Modulus of Polymer Nanoparticles during Compression: Molecular Dynamics Simulation
Paper ID : 1503-ICNS
Hamid Akbari Moayyer *1, Malek Naderi2, Ali Ramazani3, Jamshid Aghazadeh Mohandesi1
1Department of Materials and Metallurgical Engineering, Amirkabir University of Technology, Tehran, Iran
2Department of Materials and Metallurgical Engineering, Amirkabir University of Technology
3Department of Aerospace Engineering, University of Michigan, Ann Arbor, USA
Chemical mechanical planarization (CMP) is one of the most important semiconductor processes. After this process, the wafer has a surface with low roughness and has no defects. Polymer particles possess a high potential to use as abrasive in CMP. Therefore, their mechanical properties must be comprehended for the appropriate use. In the present study, the elastic modulus of polystyrene (PS) nanoparticles with various sizes is examined through molecular dynamics (MD) simulations under uniaxial compression. Also, the impact of chain length on elastic modulus is evaluated. The results reveal that the elastic modulus increases linearly by decreasing the particle size. The outcomes are compared with experimental researches and good agreement is seen.
Polystyrene nanoparticles; Molecular dynamics simulation; Elastic modulus.
Status : Abstract Accepted (Poster Presentation)