Effect of annealing temperature on structure and morphology of CuS thin films deposited by chemical bath deposition (CBD) method
Paper ID : 1246-ICNS
Sorayya Mirmohammad sadeghi1, Mohamadreza Vaezi *1, Asghar Kazemzadeh2
1Department of Nanotechnology and Advanced Materials, Materials and Energy Research Center, Tehran, Iran
2Department of Semiconductors, Materials and Energy Research Center, Tehran, Iran
In this work, thin films of copper sulphide (CuS) were deposited onto cleaned FTO glasses by using chemical bath deposition (CBD) method. Post deposition annealing was done for all samples at two temperatures of 100 ºC and 200 ºC for duration of 1 h, except the one dried at room temperature (25 ºC). The analysis of the surface morphology was carried out using atomic force microscopy (AFM) in non-contact mode. Surface roughness parameters were determined by averaging of these parameters obtained at three surfaces scanning. It was found that the deposited CuS thin films had particulate structure, which annealing affected the size of these nanoparticles and increased their size as annealing temperature increased from room temperature to 200 °C. It was resulted in enhancement in RMS surface roughness (Sq) from 30.6 nm (CuS-25 sample) to 154.3 nm (Cus-200 sample), as well. But the structure of the CuS nanoparticles remained amorphous.
CuS, thin films, chemical bath deposition, post annealing, morphology
Status : Abstract Accepted (Poster Presentation)
8th International Conference on Nanostructures 8th International Conference on Nanostructures