Conductive printed film fabricated by using copper nanoparticles
Paper ID : 1020-ICNS
Authors:
narjes tangaki *
Department of Chemical Engineering Petroleum and Gas, University of Semnan, Iran
Abstract:
In this investigation, the method of preparing conductive film by using copper nanoparticles is studied. Initially, copper nanoparticles were prepared by the polyol method. In this method, we were capping the copper nanoparticles by using a polymer layer. Using a non-aqueous solvent as a reaction medium allows us to minimize the oxidation of the copper surface. Copper particles have been confirmed by X-ray diffraction (XRD) as a face-centered cubic (Fcc) crystalline copper. The nanoparticles obtained by this method measure 20.04-17.34nm by Field Emission Scanning Electron Microscopy (FESEM) analyze. Then the copper conductive film was prepared by using this copper nanoparticle. the prepared conductive film was printed on the glass surface and then dried by using a furnace at 200 ° C for 20 min. resistivity of the film was measured by 4-point probe and It is reached to 335.35Ω. These conductive films are very useful for printed circuit boards (PCBs) and flexible electronic devices application.
Keywords:
nano copper, copper conductive film, printed film
Status : Abstract Accepted (Poster Presentation)